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Issue No.06 - Nov.-Dec. (2011 vol.28)
pp: 58-65
Kirk A. Gray , Accelerated Reliability Solutions
Michael Pecht , University of Maryland, College Park
<p>Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems' reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The results suggest that significant cost savings can be realized without compromising reliability.</p>
design and test, long-term thermal overstressing, computer, reliability, high temperature, cost savings
Kirk A. Gray, Michael Pecht, "Long-Term Thermal Overstressing of Computers", IEEE Design & Test of Computers, vol.28, no. 6, pp. 58-65, Nov.-Dec. 2011, doi:10.1109/MDT.2011.127
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