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Issue No. 06 - Nov.-Dec. (2011 vol. 28)
ISSN: 0740-7475
pp: 58-65
Michael Pecht , University of Maryland, College Park
Kirk A. Gray , Accelerated Reliability Solutions
ABSTRACT
<p>Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems' reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The results suggest that significant cost savings can be realized without compromising reliability.</p>
INDEX TERMS
design and test, long-term thermal overstressing, computer, reliability, high temperature, cost savings
CITATION
Michael Pecht, Kirk A. Gray, "Long-Term Thermal Overstressing of Computers", IEEE Design & Test of Computers, vol. 28, no. , pp. 58-65, Nov.-Dec. 2011, doi:10.1109/MDT.2011.127
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