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Issue No.06 - Nov.-Dec. (vol.28)
ISSN: 0740-7475
From the EIC
Guest Editors' Introduction
Jiun-Lang Huang , National Taiwan University
Kwang-Ting (Tim) Cheng , University of California, Santa Barbara
pp. 6
Flexible Electronics
Tsung-Ching Huang , University of Tokyo
Jiun-Lang Huang , National Taiwan University
Kwang-Ting (Tim) Cheng , University of California at Santa Barbara
pp. 8-15
William S. Wong , University of Waterloo
Tse Nga Ng , Palo Alto Research Center
Sanjiv Sambandan , Indian Institute of Science
Michael L. Chabinyc , University of California, Santa Barbara
pp. 16-23
Chester Liu , National Taiwan University
En-Hua Ma , National Taiwan University
Wen-En Wei , National Taiwan University
James Chien-Mo Li , National Taiwan University
I-Chun Cheng , National Taiwan University
Yung-Hui Yeh , Industrial Technology Research Institute
pp. 24-31
Yindar Chuo , Simon Fraser University
Badr Omrane , Simon Fraser University
Clint Landrock , Simon Fraser University
Jeydmer Aristizabal , Simon Fraser University
Donna Hohertz , Simon Fraser University
Sasan V. Grayli , Simon Fraser University
Bozena Kaminska , Simon Fraser University
pp. 32-40
Kirk A. Gray , Accelerated Reliability Solutions
Michael Pecht , University of Maryland, College Park
pp. 58-65
Dallas L. Webster , Texas Instruments
Rick Hudgens , Texas Instruments
Donald Lie , Texas Tech University
pp. 66-75
Louay Abdallah , TIMA Laboratory
Salvador Mir , TIMA Laboratory
Christophe Kelma , NXP Semiconductors
pp. 76-84
Road Ahead
Product Futures (Abstract)
Andrew B. Kahng , University of California, San Diego
pp. 88-89
CEDA Currents
TTTC Newsletter
Conference Reports
Conference Reports (Abstract)
pp. 94-95
The Last Byte
pp. 96
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