Pages: pp. 90-91
Abstract—This month's CEDA Currents newsletter presents a Call for Participation for the Frontiers in Analog Circuit (FAC) Synthesis and Verification Workshop; the 2011 EDAA Lifetime Achievement Award winner, Melvin A. Breuer; a Call for Papers for Integration, The VLSI Journal; the IEEE Embedded Systems Letters' most-accessed articles recently; and upcoming CEDA events.
Keywords—design and test, EDAA, ICCAD 2011, MemoCODE 2011, FMCAD 2011, MPSoC, Melvin A. Breuer, Lifetime Achievement Award, PATMOS 2011, IEEE Embedded Systems Letter, VLSI, VLSI-SoC 2011; Integration, The VLSI Journal; special issue on thermal modeling and simulation, thermal-aware design, and thermal management for 2D/3D ICs
The Frontiers in Analog Circuit (FAC) Synthesis and Verification Workshop, colocated with the 23rd International Conference on Computer Aided Verification (CAV), will be held 14–15 July 2011 in Cliff Lodge, Snowbird, Utah.
While the development of digital circuits is supported by many EDA tools, the development of analog and mixed-signal (AMS) circuits has lagged behind—remaining essentially an ad hoc activity, neither facilitating reuse nor easily integrated into a system-level development process. Some of the reasons for this are inherent in the technical differences between digital and analog computation. Others are more sociological, concerning the respective communities; for example, the cultural distance between EDA software developers and analog designers is far greater than that between EDA software developers and digital designers.
With the advent of embedded SoCs, this situation puts the development of analog subsystems (necessary for all interactions with the physical world) on the critical path of new product development. The semiconductor industry now realizes it needs more advanced CAD tools for simulation, verification, test, design space exploration, model reduction, synthesis, and integration with digital subsystems.
The goal of this workshop is to bring together analog designers, EDA tool providers, and researchers from verification, simulation, and control to advance the state of the art of AMS synthesis and verification.
Topics of interest include (but are not limited to) modeling approaches for analog circuits at different abstraction levels; verification of continuous models using hybrid system techniques; model checking and theorem-proving methods; use of assertions to detect errors during simulation (and for postfabrication testing); fast simulation of AMS circuits; parameter space exploration; component-based methodologies for AMS circuits; analysis of timing, power, and heat; methods that integrate verification, test, and postsilicon diagnosis; correct-by-construction approaches to AMS design, including synthesis; and analog reuse.
The European Design and Automation Association (EDAA) Lifetime Achievement Award goes each year to one individual who, during his or her lifetime, has made outstanding contributions to the state of the art in electronic design, automation, and testing of electronic systems. To be eligible, candidates must have made innovative contributions that have impacted the way electronic systems are designed.
This year's award was presented to Melvin A. Breuer at the plenary session of the 2011 Design, Automation and Test in Europe (DATE) Conference, held 14–18 March in Grenoble, France. Mel Breuer can be called a "renaissance man" and an innovator in the area of CAD and testing of digital systems. He has contributed to the growth of EDA from the early days and has performed pioneering work and long-lasting results.
Melvin A. Breuer is the Charles Lee Powell Professor of Electrical Engineering and Computer Science at the University of Southern California, Los Angeles. He has a PhD in electrical engineering from the University of California, Berkeley.
—See http://www.edaa.com for information.
Integration, The VLSI Journal seeks papers for a Special Issue on Thermal Modeling and Simulation, Thermal-Aware Design, and Thermal Management for 2D/3D ICs. One of the major challenges to continually improving the integration density of information processing and communication systems is heat removal in ICs. This heat dissipation is caused by increased power density with every new technology generation, which is the consequence of having smaller transistors and faster clock speeds.
Moreover, new design and architecture techniques, such as 3D stacked integration and multicore processors, further exacerbate this problem. High power densities are already a major concern in 2D systems, because the excessive resulting temperature exacerbates thermal and reliability conditions. But the situation becomes more severe in 3D systems because 3D integration introduces even higher power densities, owing to the placement of computational units on top of one another.
Therefore, the International Technology Roadmap for Semiconductors ( ITRS) has identified thermal management and effective cooling techniques as one of five key challenges during the next decade for achieving the projected performance goals of the industry.
This special issue will cover recent progress in thermal-related design techniques for 2D multicore and emerging 3D systems such as thermal modeling, simulation, dynamic thermal management, thermal-aware physical design and optimization, and thermal-related reliability modeling and optimization techniques. Papers with in-depth, extensive coverage of the following topics are welcome: compact thermal (heat) modeling for 3D integrated SoCs; compact thermal modeling and characterization for multicore systems; fast thermal simulation and analysis for 3D and multicore systems; thermal and mechanical stress modeling and simulation; dynamic thermal management and regulation techniques for 3D and multicore systems; thermal modeling and on-chip management using active cooling techniques; thermal- and power-aware task scheduling and optimization; thermal-aware physical design and optimization (placement, floorplanning, and logic synthesis); active cooling techniques for 3D high-performance ICs; dynamic, leakage, and total power estimation techniques; and reliability analysis and optimization techniques related to negative-bias temperature instability (NBTI) or positive-bias temperature instability (PBTI).
Manuscripts are subject to peer review and should be submitted online at http://ees.elsevier.com/vlsi by 30 June 2011. When choosing "Article Type," please select "Special Issue Thermal IC Design." All manuscripts should conform to the standard formats indicated in the "Guide for Authors" at http://authors.elsevier.com/journal/vlsi.
The top-five accessed articles from IEEE Embedded Systems Letters in February 2011 were as follows:
CEDA conferences provide excellent opportunities for those interested in learning about the latest technical trends in electronic design and automation. If you'd like to participate or you have an idea about new topics of interest for our conferences, please contact William Joyner (email@example.com), CEDA vice president of conferences.
9th International Conference on Formal Methods and Models for Codesign(MemoCODE)
11–13 July 2011
International Workshop on Power and Timing Modeling, Optimization, and Simulation (PATMOS)
26–29 Sept. 2011