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Issue No. 03 - May/June (2011 vol. 28)
ISSN: 0740-7475
pp: 86-89
Andrew B. Kahng , University of California, San Diego
<p>This column examines the challenges inherent in the signoff stage of the design cycle just prior to fabrication. Modeling trends, as well as trends from the designer side, and their possible effects on signoff are identified.</p>
design and test, physical design, signoff
Andrew B. Kahng, "The Future of Signoff", IEEE Design & Test of Computers, vol. 28, no. , pp. 86-89, May/June 2011, doi:10.1109/MDT.2011.66
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