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TABLE OF CONTENTS
Issue No. 01 - January/February (vol. 28)
ISSN: 0740-7475
Call for Papers

Call for Papers (HTML)

pp. 1
Toc

Contents (PDF)

pp. 2-3
Call for Papers

Call for Papers (HTML)

pp. 5
Guest Editors' Introduction

Nanoscale Memories Pose Unique Challenges (HTML)

Chris H. Kim , University of Minnesota
Leland Chang , IBM T.J. Watson Research Center
pp. 6-8
Perspectives
Future Landscape of Embedded Memories

Embedded DRAM in 45-nm Technology and Beyond (Abstract)

Adrian Paparelli , IBM, Essex Junction
Mark Jacunski , IBM, Essex Junction
Darren Anand , IBM, Essex Junction
Kevin Gorman , IBM, Essex Junction
pp. 14-21

Challenges and Directions for Low-Voltage SRAM (Abstract)

Masood Qazi , MIT, CAMBRIDGE
Mahmut Sinangil , MIT, 02139
pp. 32-43

Fast-Write Resistive RAM (RRAM) for Embedded Applications (Abstract)

Pang-Shiu Chen , MingShin University of Science & Technology, Hsinchu
Shyh-Shyuan Sheu , National Central University Industrial Technology Research Institute, Taoyuan Hsinchu
Kuo-Hsing Cheng , National Central University, Taoyuan
Heng-Yuan Lee , Industrial Technology Research Institute National Tsing Hua University, Hsinchu Hsinchu
Frederick T. Chen , Industrial Technology Research Institute, Hsinchu
Pei-Chia Chiang , Industrial Technology Research Institute, Hsinchu
Ming-Jinn Tsai , Industrial Technology Research Institute, Hsinchu
Wen-Pin Lin , Industrial Technology Research Institute, Hsinchu
Meng-Fan Chang , National Tsing Hua University, Hsinchu
Yu-Sheng Chen , Industrial Technology Research Institute National Tsing Hua University, Hsinchu Hsinchu
pp. 64-71
Standards

Evolution of EDA standards worldwide (Abstract)

Stan Krolikoski , Cadence Design Systems
pp. 72-75
The Road Ahead

Design for manufacturability: Then and now (Abstract)

Andrew B. Kahng , University of California, San Diego
pp. 76-77
Book Reviews

EDA: Synergy or sum of the parts? (HTML)

Igor L. Markov , University of Michigan
pp. 78-79
Conference Reports

Conference Reports (Abstract)

pp. 80-81
CEDA Currents

CEDA Currents (HTML)

pp. 82-83
DATC Newsletter
TTTC Newsletter
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