The Community for Technology Leaders
RSS Icon
Issue No.06 - November/December (2010 vol.27)
pp: 58-68
Mohammad Al Faruque , CES:Chair for Embedded Systems , Karlsruhe
Janmartin Jahn , Karlsruhe Institute of Technology, Karlsruhe
Joerg Henkel , University of Karlsruhe, Karlsruhe
<p><it>Editor's note:</it></p><p>System-level runtime approaches provide a new dimension of variation tolerance in multi- and many-core systems. This article looks into a scalable system-level, dynamic thermal management solution using an agent-based, distributed-application-mapping approach.</p><p align="right"><it>&#x2014;Swarup Bhunia, Case Western Reserve University</it></p>
design and test, multicore, single-chip multiprocessors, hardware reliability, adaptable architectures, on-chip interconnection networks, distributed systems, multiagent systems
Mohammad Al Faruque, Janmartin Jahn, Joerg Henkel, "Runtime Thermal Management Using Software Agents for Multi- and Many-Core Architectures", IEEE Design & Test of Computers, vol.27, no. 6, pp. 58-68, November/December 2010, doi:10.1109/MDT.2010.94
1. J.M. Rabaey and S. Malik, "Challenges and Solutions for Late- and Post-Silicon Design," IEEE Design and Test, vol. 25, no. 4, 2008, pp. 296-302.
2. G.M. Link and N. Vijaykrishnan, "Thermal Trends in Emerging Technologies," Proc. 7th Int'l Symp. Quality Electronic Design (ISQED 06), IEEE CS Press, 2006, pp. 625-632.
3. J. Srinivasan et al., "Lifetime Reliability: Toward an Architectural Solution," IEEE Micro, vol. 25, no. 3, 2005, pp. 70-80.
4. B. Li, L.-S. Peh, and P. Patra, "Impact of Process and Temperature Variations on Network-on-Chip Design Exploration," Proc. 2nd ACM/IEEE Int'l Symp. Networks-on-Chip (NOCS 08), IEEE CS Press, 2008, pp. 117-126.
5. O.S. Unsal et al., "Impact of Parameter Variations on Circuits and Microarchitecture," IEEE Micro, vol. 26, no. 6, 2006, pp. 30-39.
6. T. Ebi, M.A. Al Faruque, and J. Henkel, "TAPE: Thermal-Aware Agent-Based Power Economy for Multi/Manycore Architectures," Proc. Int'l Conf. Computer-Aided Design (ICCAD 09), IEEE CS Press, 2009, pp. 302-309.
7. S. Garg et al., "Technology-Driven Limits on DVFS Controllability of Multiple Voltage-Frequency Island Designs: A System-Level Perspective," Proc. 46th Conf. Design Automation (DAC 09), ACM Press, 2009, pp. 818-821.
8. I. Yeo, C.C. Liu, and E.J. Kim, "Predictive Dynamic Thermal Management for Multicore Systems," Proc. 45th Design Automation Conf. (DAC 08), ACM Press, 2008, pp. 734-739.
9. M. Gomaa, M.D. Powell, and T.N. Vijaykumar, "Heat-and-Run: Leveraging SMT and CMP to Manage Power Density through the Operating System," SIGOPS Operating Systems Rev., vol. 38, no. 5, 2004, pp. 260-270.
10. M.A. Al Faruque, R. Krist, and J. Henkel, "ADAM: Run-Time Agent-Based Distributed Application Mapping for On-Chip Communication," Proc. 45th Conf. Design Automation (DAC 08), ACM Press, 2008, pp. 760-765.
11. S.R. White et al., "Autonomic Computing: Architectural Approach and Prototype," Integrated Computer-Aided Eng., vol. 13, no. 2, 2006, pp. 173-188.
12. J. Howard et al., "A 48-Core IA-32 Message-Passing Processor with DVFS in 45nm CMOS," Proc. Int'l Solid-State Circuits Conf. (ISSCC 10), IEEE Press, 2010, pp. 108-109.
40 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool