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Flexible electronics are emerging as an alternative to conventional silicon electronics for large-area low-cost applications such as rollable displays and TVs, e-papers, smart sensors, and disposable RFID tags. By using inexpensive manufacturing methods (e.g., ink-jet printing and roll-to-roll imprinting), flexible electronics can be printed on low-cost plastics like printing newspapers. These advantages make flexible electronics an attractive candidate for next-generation consumer products that require lightweight, bendable, portable, and low-cost electronics.

The key elements of flexible electronics, however—thin-film transistors (TFTs)—have a much slower operating speed and are less reliable than their silicon electronics counterparts. Furthermore, depending on the material properties, TFTs are usually monotype (either p- or n-type) devices—making air-stable complementary TFT circuits is challenging and not feasible for most TFT technologies. Existing design and test technologies for silicon electronics, therefore, cannot be directly applied to flexible electronics.

This special issue will provide an overview on the challenges, current practice, and future research directions for design and test of flexible electronics for various applications. The issue's scope will primarily emphasize flexible circuit design and system integration.

IEEE Design & Test seeks original manuscripts for this special issue scheduled for publication in November/December 2011. The topics of interest include (but are not limited to) the following:

  • Flexible analog, digital, and mixed-signal circuit designs and design methodologies
  • Flexible sensors and solar cells
  • Flexible displays
  • Flexible systems
  • Reliability and testing

Submission and review procedures

Prospective authors should follow the submission guidelines for IEEE Design & Test. All manuscripts must be submitted electronically to the IEEE Manuscript Central Web site at Indicate that you are submitting your article to the special issue on "Design and Test of Flexible Electronics." All articles will undergo the standard IEEE Design & Test review process. Submitted manuscripts must not have been previously published or currently submitted for publication elsewhere. Manuscripts must not exceed 5,000 words, including figures (with each average-size figure counting as 200 words) and a maximum of 12 References (30 for surveys). This amounts to about 4,000 words of text and a maximum of five small to medium figures. Accepted articles will be edited for clarity, structure, conciseness, grammar, logical organization, readability, and adherence to D&T and Computer Society style. Please see IEEE D&T Author Resources at, then scroll down and click on Author Center for submission guidelines and requirements.


  • Articles due for review: 15 March 2011
  • Reviews completed: 15 May 2011
  • Article revisions due: 15 June 2011
  • Notice of final acceptance: 31 July 2011
  • All materials due for edit: 30 August 2011
  • Publication date: November/December 2011


Please direct questions regarding this special issue to Guest Editors Jiun-Lang Huang ( or Tim Cheng (

Special Issue on Design and Test of Flexible Electronics

November/December 2011

Guest Editors: Jiun-Lang Huang (National Taiwan University)

and Tim Cheng (University of California, Santa Barbara)

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