Issue No. 04 - July/August (2010 vol. 27)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2010.55
Hong Li , University of California, Santa Barbara
Chuan Xu , University of California, Santa Barbara
Kaustav Banerjee , University of California, Santa Barbara
<p>Editor's note:</p><p>Carbon nanotubes and graphene nanoribbons are two promising next-generation interconnect technologies. Electrical modeling and performance analysis have demonstrated the superiority of these emerging technologies compared to conventional copper interconnects, as this article explains.</p><p align="right">—Sriram Vangal, Intel</p>
design and test, carbon nanomaterials, carbon nanotube (CNT), graphene nanoribbon (GNR), electrical interconnects, optical interconnects, RF or wireless interconnects, on-chip vias, through-silicon vias (TSVs), delay, power
H. Li, K. Banerjee and C. Xu, "Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs," in IEEE Design & Test of Computers, vol. 27, no. , pp. 20-31, 2010.