The Community for Technology Leaders
Green Image
TABLE OF CONTENTS
Issue No. 04 - July/August (vol. 27)
ISSN: 0740-7475
Call for Papers

Call for Papers (PDF)

pp. 1
From the EIC
Emerging Interconnect Technologies for Gigascale Integration

Table of Contents (PDF)

pp. 2
Emerging Interconnect Technologies for Gigascale Integration

Short-Range, Wireless Interconnect within a Computing Chassis: Design Challenges (Abstract)

Huaping Liu , Oregon State University
Changhui Hu , Oregon State University
Rahul Khanna , Intel
Sirikarn Woracheewan , Oregon State University
Jay Nejedlo , Intel
Lei Guo , Oregon State University
Patrick Yin Chiang , Oregon State University
pp. 32-43

Wireless Interconnect and the Potential for Carbon Nanotubes (Abstract)

Andre Ivanov , University of British Columbia
Alireza Nojeh , University of British Columbia
pp. 44-53

Global On-Chip Coordination at Light Speed (Abstract)

Wounjhang Park , University of Colorado at Boulder
Yihe Sun , Tsinghua University
Dejan S. Filipovic , University of Colorado at Boulder
Hongyu Zhou , University of Colorado at Boulder
Li Shang , University of Colorado at Boulder
Xi Chen , University of Colorado at Boulder
Alan R. Mickelson , University of Colorado at Boulder
Zheng Li , Tsinghua University
Moustafa Mohamed , University of Colorado at Boulder
Manish Vachharajani , University of Colorado at Boulder
Dejan S. Filipovic , University of Colorado at Boulder
pp. 54-67
Book Reviews

Chips in 3D (HTML)

Igor Markov , University of Michigan
pp. 68-69
The Road Ahead

When is 3D 2B? (Abstract)

Andrew B. Kahng , University of California, San Diego
pp. 70-71
CEDA Currents

CEDA Currents (HTML)

pp. 72-73
DATC Newsletter
Conference Reports

Conference Reports (Abstract)

Rohit Kapur , Synopsys
pp. 77
TTTC Newsletter
The Last Byte

On-chip networks: Two sides of the same coin (Abstract)

Radu Marculescu , Carnegie Mellon University
pp. 80
91 ms
(Ver )