Issue No. 05 - September/October (2009 vol. 26)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2009.119
Philip Emma , IBM Research
Eren Kursun , IBM Research
<p>Editor's note:</p><p>This article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues.</p><p align="right">—Yuan Xie, Pennsylvania State University</p>
E. Kursun and P. Emma, "Opportunities and Challenges for 3D Systems and Their Design," in IEEE Design & Test of Computers, vol. 26, no. , pp. 6-14, 2009.