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Issue No.05 - September/October (2009 vol.26)
pp: 6-14
Philip Emma , IBM Research
Eren Kursun , IBM Research
<p>Editor's note:</p><p>This article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues.</p><p align="right">&#x2014;Yuan Xie, Pennsylvania State University</p>
3D systems
Philip Emma, Eren Kursun, "Opportunities and Challenges for 3D Systems and Their Design", IEEE Design & Test of Computers, vol.26, no. 5, pp. 6-14, September/October 2009, doi:10.1109/MDT.2009.119
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