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TABLE OF CONTENTS
Issue No. 05 - September/October (vol. 26)
ISSN: 0740-7475

Table of Contents (PDF)

pp. c2
Departments

Stacking chips in 3D (Abstract)

pp. 2
Special Issue

Optimizing Decoupling Capacitors in 3D Circuits for Power Grid Integrity (Abstract)

Sachin S. Sapatnekar , University of Minnesota, Twin Cities
Pingqiang Zhou , University of Minnesota, Twin Cities
Karthikk Sridharan , University of Minnesota, Twin Cities
pp. 15-25

Test Challenges for 3D Integrated Circuits (Abstract)

Krishnendu Chakrabarty , Duke University
Hsien-Hsin S. Lee , Georgia Institute of Technology
pp. 26-35

3D DRAM Design and Application to 3D Multicore Systems (Abstract)

Tong Zhang , Rensselaer Polytechnic
Jibang Liu , Rensselaer Polytechnic
Jian-Qiang Lu , Rensselaer Polytechnic
Nanning Zheng , Xi'an Jiaotong University
Kenneth Rose , Rensselaer Polytechnic
Hongbin Sun , Xi'an Jiaotong University
pp. 36-47
Special ITC Section
Departments

Call for Papers (HTML)

pp. 63
Special ITC Section

Statistics in Semiconductor Test: Going beyond Yield (Abstract)

W. Robert Daasch , Portland State University
Amit Nahar , Texas Instruments
C. Glenn Shirley , Portland State University
pp. 64-73

Multidimensional Test Escape Rate Modeling (Abstract)

Jayashree Saxena , Texas Instruments
John M. Carulli Jr. , Texas Instruments
Amit Nahar , Texas Instruments
W. Robert Daasch , Portland State University
Kenneth M. Butler , Texas Instruments
pp. 74-82
Other Features

A Generic Virtual Bus for Hardware Simulator Composition (Abstract)

Axel Böttcher , Munich University of Applied Sciences
Martin Ruckert , Munich University of Applied Sciences
pp. 83-91

Robust On-Chip Signaling by Staggered and Twisted Bundle (Abstract)

Lei He , University of California, Los Angeles
Mau-Chung Frank Chang , University of California, Los Angeles
Hao Yu , Berkeley Design Automation
pp. 92-104
Departments

Teaching someone to fish (HTML)

Grant Martin , Tensilica
pp. 106-107

CEDA Currents (HTML)

pp. 108-110

The fate of stacking (Abstract)

David S. Kung , IBM T.J. Watson Research Center
pp. 112
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