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Issue No.02 - March/April (vol.26)
ISSN: 0740-7475
pp. 2-3
From the EIC
Special Issue
Andrew Chang , MediaTek
pp. 14-19
Jean-Pierre Schoellkopf , STMicroelectronics, Crolles, France
Philippe Magarshack , STMicroelectronics, Crolles, France
pp. 20-29
Other Features
Kai-hui Chang , Avery Design Systems
David A. Papa , University of Michigan, Ann Arbor
Igor L. Markov , University of Michigan, Ann Arbor
Valeria Bertacco , University of Michigan, Ann Arbor
pp. 34-43
Wei Zhang , Southern Illinois University Carbondale
pp. 44-51
Andreas Apostolakis , University of Piraeus
Dimitris Gizopoulos , University of Piraeus
Mihalis Psarakis , University of Piraeus
Danilo Ravotto , Politecnico di Torino
Matteo Sonza Reorda , Politecnico di Torino
pp. 52-63
Li-Ming Denq , National Tsing Hua University
Yu-Tsao Hsing , National Tsing Hua University
Cheng-Wen Wu , National Tsing Hua University
pp. 64-73
DATC Newsletter
Book Review
Grant Martin , Tensilica
pp. 76-77
TTTC Newsletter
CEDA Currents
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