The Council on Electronic Design Automation was formed in mid 2005 by its six member societies (the Antennas and Propagation Society, the Circuits and Systems Society, the Computer Society, the Electron Devices Society, the Microwave Theory and Techniques Society, and the Solid-State Circuits Society) to provide a focus on the field of electronic design automation. Since that time, CEDA has sponsored an impressive list of publications, conferences, workshops, and new activities, all focused on advancing the EDA profession. CEDA is sound financially, and successfully completed a review in November 2007 to become a permanent council of the IEEE. Much of the credit goes to Al Dunlop, CEDA's creator and former president, along with the officers and committee chairs for getting CEDA so firmly established.
As we go forward in 2008, our Executive Committee now has some newly elected members:
• President: John Darringer
• President-Elect: Andreas Kuehlmann
• Past President: Al Dunlop
• Vice President of Activities: Soha Hassoun
• Vice President of Conferences: Bill Joyner
• Vice President of Finance: Donatella Sciuto
• Vice President of Publications: Rajesh Gupta
• Awards Committee Chair: William Joyner (acting)
• Nominations Committee Chair: Al Dunlop
• Secretary: David Atienza
The challenge in the coming year is to continue to strengthen existing programs, find new ways to serve the changing profession, and reach more of the global EDA community. As the EDA field continues to evolve, CEDA will explore publications in emerging areas as well as alternative modes of communication, such as electronic editions, to improve communication within the EDA community while preserving the tradition of high quality. CEDA plans to strengthen its support for existing EDA conferences and begin streamlining the process for obtaining CEDA sponsorship, especially for smaller workshops in emerging areas. Special events have been quite successful. These include CEDA-sponsored sessions at the Design Automation Conference (DAC) and the International Conference on Computer-Aided Design (ICCAD) on ethics, and CEDA's Distinguished Lecture Series. We are planning more events like this in the future.
Over its short history, CEDA has explored different approaches for improving the EDA profession. Some have worked, and others still need refinement. We have formed a committee to examine EDA awards, leading to collaborations with the Electronic Design Automation Consortium (EDAC) and ACM SIGDA to increase recognition for EDA contributions. Another committee is studying how EDA standards are created today and looking for ways to improve this process. More volunteers are needed for these and other CEDA activities, and new ideas are always welcome. If you'd like to get involved or have a proposal, please contact me (email@example.com) or any member of the Executive Committee.
—John Darringer, CEDA president
The grade of IEEE Fellow is an award for someone with an extraordinary record of accomplishments in any of the IEEE scientific areas of interest. The IEEE Board of Directors confers this grade on those IEEE members who have made important contributions to the advancement or application of engineering, science, and technology.
Nominations are now being accepted for the IEEE Fellows class of 2009. There are four categories for which a person may be nominated: application engineer or practitioner, research engineer or scientist, educator, and technical leader. Each candidate must be a senior member of the IEEE and must have served as an IEEE member for at least five years prior to 1 January of the year of election.
For further information, please visit the IEEE Fellows Web site: http://www.ieee.org/web/membership/fellows/index.html.
John Vig Selected as 2008 IEEE President-Elect
John Vig, a consultant for System Planning Corp., has been selected as 2008 IEEE president-elect. He will begin serving as IEEE president on 1 January 2009. An IEEE Fellow, Vig has been an active IEEE volunteer for over 30 years and has spent his professional career working as an electronics engineer. For more information, please contact Francine Tardo (firstname.lastname@example.org).
New Dimensions in IC Design
3D ICs have emerged as an attractive option for overcoming the barriers in interconnect scaling. The key benefits of 3D ICs over traditional 2D chips include reduction of global interconnects, higher packing density and smaller footprint, and support for mixed-technology integration. To efficiently exploit the benefits of 3D technologies, design techniques and methodologies for supporting 3D designs are imperative. Design space exploration at the architectural level is also essential to fully take advantage of 3D integration technologies and build a high-performance microprocessor. A 3D tutorial organized by Yuan Xie (Penn State University) and Gabe Loh (Georgia Tech) will be presented at the 35th International Symposium on Computer Architecture (ISCA 08), which will take place on 21-25 June in Beijing. For more information, please contact Yuan Xie (email@example.com).
Winners of best-paper awards at some of the outstanding events in 2007 and early 2008 include the following:
• A. Davare et al., "Period Optimization for Hard Real-Time Distributed Automotive Systems," 45th Design Automation Conference (DAC 2007).
• H. Inoue et al., "Dynamic Security Domain Scaling on Symmetric Multiprocessors for Future High-End Embedded Systems," International Conference on Hardware/Software Codesign and System Synthesis (CODES-ISSS 07).
• A. Singhee and R.A. Rutenbar, "Statistical Blockade: A Novel Method for Very Fast Monte Carlo Simulation of Rare Circuit Events and Its Application," Design, Automation and Test in Europe Conference (DATE 07).
• S. Watanabe et al., "Protocol Transducer Synthesis Using Divide and Conquer Approach," 12th Asian and South Pacific Design Automation Conference (ASP-DAC 07).
• Y. Zhou et al., "A New Methodology for Interconnect Parasitics Extraction Considering Photo-Lithography Effects," 17th ACM Great Lakes Symposium on VLSI (GLSVLSI 07).
• F. Wang, X. Wu, and Y. Xie, "Variability-Driven Module Selection with Joint Design Time Optimization and Post-Silicon Tuning," 13th Asian and South Pacific Design Automation Conference (ASP-DAC 08).
CEDA currently sponsors or cosponsors 10 conferences and workshops, and two additional conferences in which it is in technical cooperation with other societies. Our conferences provide excellent opportunities for those interested in learning about the latest technical trends in electronic design and automation, and to be engaged with a community of volunteers. If you are interested in participating or have an idea about new topics of interest for our conferences, please contact Bill Joyner (firstname.lastname@example.org), CEDA vice president of conferences.
6th ACM-IEEE International Conference on Formal Methods and Models for Codesign (MEMOCODE)
5-7 June 2008
45th Design Automation Conference (DAC)
8-13 June 2008