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Issue No. 02 - March-April (vol. 25)
ISSN: 0740-7475
From the EIC
Special Issue Features

Guest Editors' Introduction: Progress in Test Compression (HTML)

Nur A. Touba , University of Texas at Austin
Scott Davidson , Sun Microsystems
pp. 112-113

Historical Perspective on Scan Compression (Abstract)

Rohit Kapur , Synopsys
Subhasish Mitra , Stanford University
pp. 114-120

VirtualScan: Test Compression Technology Using Combinational Logic and One-Pass ATPG (Abstract)

Xinli Gu , Cisco Systems
Boryau Sheu , SynTest Technologies
Zhigang Wang , Cisco Systems
Laung-Terng Wang , SynTest Technologies
Shianling Wu , SynTest Technologies
Xiaoqing Wen , Kyushu Institute of Technology
Zhigang Jiang , SynTest Technologies
pp. 122-130

UMC-Scan Test Methodology: Exploiting the Maximum Freedom of Multicasting (Abstract)

Chao-Wen Tzeng , National Tsing-Hua University
Shi-Yu Huang , National Tsing-Hua University
pp. 132-140
RFIC Chips, Part 2

Loopback DFT for Low-Cost Test of Single-VCO-Based Wireless Transceivers (Abstract)

Ganesh Srinivasan , Texas Instruments
Abhijit Chatterjee , Georgia Institute of Technology
Friedrich Taenzler , Texas Instruments
pp. 150-159

Wireless System for Microwave Test Signal Generation (Abstract)

Qizhang Yin , Monolithic Power Systems
William R. Eisenstadt , University of Florida
Tian Xia , Spansion
pp. 160-166
Other Features

An Illustrated Methodology for Analysis of Error Tolerance (Abstract)

Haiyang (Henry) Zhu , Analog Devices
Melvin A. Breuer , University of Southern California
pp. 168-177

Device Model for Ballistic CNFETs Using the First Conducting Band (Abstract)

Hamidreza Hashempour , NXP Semiconductors
Fabrizio Lombardi , Northeastern University
pp. 178-186
DATC Newsletter

DATC Newsletter (HTML)

pp. 187

Standards update from IP 07 (Abstract)

Victor Berman , Improv Systems
pp. 192-193
Book Reviews

Building your yield of dreams (HTML)

Sachin Sapatnekar , University of Minnesota
pp. 194-195
CEDA Currents

CEDA Currents (HTML)

pp. 196-197
TTTC Newsletter

TTTC Newsletter (HTML)

pp. 198-199
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