Issue No. 01 - January-February (2008 vol. 25)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2008.9
Changwook Yoon , Korea Advanced Institute of Science and Technology
Junwoo Lee , Hynix Semiconductor
Young-Jin Park , Korea Electrotechnology Research Institute
Hyunjeong Park , Korea Advanced Institute of Science and Technology
Jaemin Kim , Korea Advanced Institute of Science and Technology
Jun So Pak , Korea Advanced Institute of Science and Technology
Joungho Kim , Korea Advanced Institute of Science and Technology
This article introduces a low-noise ultrawideband transceiver system-in-package design for a compact implementation in a small mobile platform. In the designed UWB transceiver SiP, the transmitter chip has a fully digital circuit implementation with a band-pass filter, and the receiver chip has a noncoherent architecture. To reduce noise generation and coupling in the densely integrated SiP design, the authors considered signal integrity issues at the high-frequency channel, and power integrity issues at the power distribution network in the SiP substrate. To ensure signal integrity, the authors minimized reflection loss at the high frequency channel through a balanced impedance-matching technique. To secure power integrity, they carefully managed cavity resonance frequencies and the split plane when designing the power-ground plane of the SiP substrate. They have successfully demonstrated 100 Mbps wireless data transmission using the proposed UWB transceiver SiP with a power consumption of 30.4 mW.
UWB, SiP, transceiver, low noise, signal integrity, power integrity
J. Lee et al., "Design of a Low-Noise UWB Transceiver SiP," in IEEE Design & Test of Computers, vol. 25, no. , pp. 18-28, 2008.