Issue No. 04 - July/August (2007 vol. 24)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2007.147
UPCOMING TTTC EVENTS
5th IEEE East-West Design & Test International Symposium (EWDTS 07)
7-10 September 2007
The main goal of the 5th IEEE East-West Design & Test Symposium is for scientific schools and experts from Eastern and Western Europe, as well as the US and other parts of the world, to share their experience in the design, design automation, and test of electronic systems. The symposium especially aims to attract scientists from areas around the Black Sea, including Ukraine, Russia, Bulgaria, Romania, Georgia, Armenia, Turkey, Belarus, the Baltic states, and the countries of Central Asia.
22nd IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT 07)
26-28 September 2007
DFT provides an annual forum for presentations in the field of defect and fault tolerance in VLSI systems, including emerging technologies. One of the unique features of this symposium is that it combines new academic research with state-of-the-art industry data-necessary ingredients for significant advances in this field. Topics for discussion at this year's symposium include all aspects of design, manufacturing, test, reliability, and availability that are affected by defects during manufacturing and by faults during system operation.
IEEE 16th Asian Test Symposium (ATS 07)
9-11 October 2007
The Asian Test Symposium provides an annual international forum for engineers and researchers from around the world, especially Asia, to present and discuss various aspects of system, board, and device testing. This year's focus is on test methods for nanometer technologies.
International Test Conference (ITC 07)
23-25 October 2007
Santa Clara, California
The International Test Conference is the world's premier conference on the electronic test of devices, boards, and systems, covering the complete cycle from design verification, test, diagnosis, and failure analysis, to process and design improvement. At ITC, test and design professionals can confront the challenges that the industry faces and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.
NEWSLETTER EDITOR'S INVITATION
I would appreciate input and suggestions about the newsletter from the test community. Please forward your ideas, contributions, and information on awards, conferences, and workshops to Bruce C. Kim, Dept. of Electrical and Computer Engineering, Univ. of Alabama, 317 Houser Hall, Tuscaloosa, AL 35487-0286; email@example.com.
Bruce C. Kim
Editor, TTTC Newsletter
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