Issue No.04 - July/August (2007 vol.24)
Salem Abdennadher , Intel
Saghir A. Shaikh , Cadence Design Systems
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2007.143
Most mixed-signal and RF IC testing in industry today involves specification-based testing using ATE. However, some companies employ alternative solutions to ATE testing that use DFT and BIST. This article presents a brief overview of common IC industry practices in mixed-signal testing and RF testing with emphasis on wired and wireless transceiver testing. The authors also discuss the testing challenges of system-in-package (SiP) technology, and present a few practiced DFT solutions.
built-in tests, DFT, I/O testing, SiP testing, wireless transceiver testing, ATE
Salem Abdennadher, Saghir A. Shaikh, "Practices in Mixed-Signal and RF IC Testing", IEEE Design & Test of Computers, vol.24, no. 4, pp. 332-339, July/August 2007, doi:10.1109/MDT.2007.143