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Issue No. 03 - May-June (2007 vol. 24)
ISSN: 0740-7475
pp: 291
A Message from the Chair
As 2007 progresses, we are seeing a lot of activity in the EDA industry. First, technology challenges have finally broken critical manufacturability topics into the EDA mainstream, as is evident from recent design for manufacturability (DFM) conference sessions, announcements, and mergers in the first quarter of this year. Second, the EDA business climate has finally moved into an era of relatively high growth for some of the larger players, combined with continued steep competition and potentially waning litigation.
DATC has also been increasing its level of activity dramatically, with several projects in flight. Our newsletter is in full working mode, with the first major issue due sometime this quarter. Our upcoming EDA conference activities have been outlined and will be detailed soon, including first-time educational sessions at major conferences. Our collaboration with and insertion in the broader community continues, with participation in the development of overseas certification programs. Finally, our Web presence is continually improving. Please visit us at for the latest on our activities, organization, and status.
Juan-Antonio Carballo
DATC chair
From the Newsletter Editor
Please e-mail me with any requests you might have regarding the DATC Web site. There is a guestbook there, and I'd love to hear your questions and comments. All are welcome! We are trying very hard to make this technical committee one of the best, and we appreciate any help you can give us. Thanks.
I also want to take an opportunity to call your attention to one of our most active subcommittees, the Electronic Design Process Subcommittee. EDPS held its yearly workshop on 12-13 April this year in Monterey, California. Take a look at this subcommittee's very informative Web site ( for the results of this workshop.
Thanks again.
Joe Damore
Newsletter Editor
10th Euromicro Conference on Digital System Design (DSD): Architectures, Methods and Tools
Lübeck, Germany
27-31 August 2007
20th Symposium on Integrated Circuits and Systems Design (SBCCI)
3-6 September 2007
Rio de Janeiro
IFIP International Conference on Very Large Scale Integration (VLSI-SoC)
15-17 October 2007
25th IEEE International Conference on Computer Design (ICCD)
7-10 October 2007
Lake Tahoe, California
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