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Issue No. 03 - May/June (vol. 23)
ISSN: 0740-7475
From the EIC

The Need for a SiP Design and Test Infrastructure (HTML)

Kwang-Ting (Tim) Cheng , University of California, Santa Barbara
pp. 181
DAC Watch

DAC Highlights (HTML)

Sachin Sapatnekar , University of Minnesota
Grant Martin , Tensilica
pp. 182-184
Conference Reports

2006 Latin American Test Workshop (HTML)

Fabian Vargas , General Chair, LATW '06
pp. 185
System-in-Package Design and Test

Guest Editors' Introduction: Big Innovations in Small Packages (HTML)

Bruce C. Kim , University of Alabama
Yervant Zorian , Virage Logic
pp. 186-187

Cell Phone Integration: SiP, SoC, and PoP (Abstract)

William Krenik , Texas Instruments
Peter Rickert , Texas Instruments
pp. 188-195

System-in-Package Testing: Problems and Solutions (Abstract)

Matteo Sonza Reorda , Politecnico di Torino
Michelangelo Grosso , Politecnico di Torino
Davide Appello , STMicroelectronics
Paolo Bernardi , Politecnico di Torino
pp. 203-211

Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array (Abstract)

Choonheung Lee , Amkor Technology Korea
Ho Choi , Amkor Technology Korea
Joungho Kim , Korea Advanced Institute of Science and Technology
Kicheol Bae , Amkor Technology Korea
Dong Gun Kam , Korea Advanced Institute of Science and Technology
Jiheon Yu , Amkor Technology Korea
pp. 212-219

Electronic System, Platform, and Package Codesign (Abstract)

Vijay K. Madisetti , Georgia Institute of Technology
pp. 220-233

A Novel DFT Technique for Testing Complete Sets of ADCs and DACs in Complex SiPs (Abstract)

Vincent Kerz?rho , Philips Semiconductors and LIRMM
Philippe Cauvet , Philips Semiconductors
pp. 234-243
Book Reviews

The First Transaction, but not the Last (HTML)

Grant Martin , Tensilica
pp. 248-249

Test Technology Technical Council Newsletter (HTML)

Bruce C. Kim , University of Alabama
pp. 250

CEDA Currents (HTML)

pp. 252-253
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