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Issue No. 03 - May/June (2006 vol. 23)
ISSN: 0740-7475
pp: 212-219
Choonheung Lee , Amkor Technology Korea
Ho Choi , Amkor Technology Korea
Joungho Kim , Korea Advanced Institute of Science and Technology
Kicheol Bae , Amkor Technology Korea
Dong Gun Kam , Korea Advanced Institute of Science and Technology
Jiheon Yu , Amkor Technology Korea
Editor's note: System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation. This article addresses problems with wire-bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities.
wire bonded plastic ball grid array, WB-PBGA, 40 Gb/s Serial Link, chip-to-chip serial link, SiP, System-in-Package
Choonheung Lee, Ho Choi, Joungho Kim, Kicheol Bae, Dong Gun Kam, Jiheon Yu, "Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array", IEEE Design & Test of Computers, vol. 23, no. , pp. 212-219, May/June 2006, doi:10.1109/MDT.2006.78
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