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Issue No. 03 - May/June (2006 vol. 23)
ISSN: 0740-7475
pp: 196-202
Thomas Brandtner , Infineon Technologies
Editor's note: Design engineers are challenged with two separate entities: the chip and package designs. Because system in package integrates multiple dies into a package, design engineers should have a tool to easily combine the two entities. This article demonstrates a seven-die SiP design that implements a chip-and-package codesign platform using available EDA tools.
Mixed-Signal System-in-Package design, SiP

T. Brandtner, "Chip-Package Codesign Flow for Mixed-Signal SiP Designs," in IEEE Design & Test of Computers, vol. 23, no. , pp. 196-202, 2006.
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