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Issue No. 03 - May/June (2006 vol. 23)
ISSN: 0740-7475
pp: 188-195
Peter Rickert , Texas Instruments
William Krenik , Texas Instruments
Editor's note: Engineers must make many cost-effective decisions during a product'sdesign cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, package-on-package and integration for mobile phone applications.
SiP, SoC, PiP, PoP, analog integration, RF integration, memory integration

W. Krenik and P. Rickert, "Cell Phone Integration: SiP, SoC, and PoP," in IEEE Design & Test of Computers, vol. 23, no. , pp. 188-195, 2006.
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