Issue No. 03 - May/June (2006 vol. 23)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2006.83
Kwang-Ting (Tim) Cheng , University of California, Santa Barbara
Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.
SiP, system in package
K. (. Cheng, "The Need for a SiP Design and Test Infrastructure," in IEEE Design & Test of Computers, vol. 23, no. , pp. 181, 2006.