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Issue No. 03 - May/June (2006 vol. 23)
ISSN: 0740-7475
pp: 181
Kwang-Ting (Tim) Cheng , University of California, Santa Barbara
ABSTRACT
Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.
INDEX TERMS
SiP, system in package
CITATION

K. (. Cheng, "The Need for a SiP Design and Test Infrastructure," in IEEE Design & Test of Computers, vol. 23, no. , pp. 181, 2006.
doi:10.1109/MDT.2006.83
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