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Issue No. 06 - November/December (2005 vol. 22)
ISSN: 0740-7475
pp: 556-564
Christianto C. Liu , Cornell University
Ilya Ganusov , Cornell University
Martin Burtscher , Cornell University
Sandip Tiwari , Cornell University
Bringing the memory close to the processor is obviously a good idea forreducing latency, but the memory is not a monolith: It includes submodules, and their arrangement determines the effectiveness of using 3D technology. The authors look at various scenarios for arranging the CPU relative to the memory modules and provide a quantitative comparison.
three-dimensional integration 3-D ICs microprocessor cache design stream prefetching embedded DRAM

I. Ganusov, M. Burtscher, S. Tiwari and C. C. Liu, "Bridging the Processor-Memory Performance Gapwith 3D IC Technology," in IEEE Design & Test of Computers, vol. 22, no. , pp. 556-564, 2005.
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