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Issue No. 06 - November/December (2005 vol. 22)
ISSN: 0740-7475
pp: 548-555
Annie (Yujuan) Zeng , Rensselaer Polytechnic Institute
James (JianQiang) L? , Rensselaer Polytechnic Institute
Kenneth Rose , Rensselaer Polytechnic Institute
Ronald J. Gutmann , Rensselaer Polytechnic Institute
The advantages of 3D design can be exploited by reducing the memoryaccess time. In this article, the authors use a simulator based on analyticalmodels to build an optimal processor-memory configuration for two designs:a graphics processor and a microprocessor.
Access time, cycle time, cache performance, wafer-level 3D integration, SRAM, DRAM

K. Rose, A. (. Zeng, J. (. L? and R. J. Gutmann, "First-Order Performance Prediction of Cache Memory with Wafer-Level3D Integration," in IEEE Design & Test of Computers, vol. 22, no. , pp. 548-555, 2005.
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