Issue No.06 - November/December (2005 vol.22)
Sung Kyu Lim , Georgia Institute of Technology
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2005.149
Systems on package constitute a specific class of 3D designs wherein multiple manufactured die are stacked atop one another in a package that embeds both active and passive components. This article considers the problem of physical design for such an environment.
3D packaging, System-On-Package, placement and routing, thermal distribution, decoupling capacitors, crosstalk
Sung Kyu Lim, "Physical Design for 3D System on Package", IEEE Design & Test of Computers, vol.22, no. 6, pp. 532-539, November/December 2005, doi:10.1109/MDT.2005.149