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Issue No. 06 - November/December (2005 vol. 22)
ISSN: 0740-7475
pp: 532-539
Sung Kyu Lim , Georgia Institute of Technology
Systems on package constitute a specific class of 3D designs wherein multiple manufactured die are stacked atop one another in a package that embeds both active and passive components. This article considers the problem of physical design for such an environment.
3D packaging, System-On-Package, placement and routing, thermal distribution, decoupling capacitors, crosstalk

S. K. Lim, "Physical Design for 3D System on Package," in IEEE Design & Test of Computers, vol. 22, no. , pp. 532-539, 2005.
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