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Issue No. 01 - January/February (vol. 22)
ISSN: 0740-7475
EIC Message

Global competitiveness, outsourcing, and education in the semiconductor industry (HTML)

Rajesh Gupta , Editor in Chief, <em>IEEE Design & Test</em>
pp. 5-6
Special Section: Perspectives on Outsourcing

Is engineering a viable profession in the US? (Abstract)

Stephen H. Unger , Columbia University
pp. 10-11

The truth about outsourcing (Abstract)

T.J. Rodgers , Cypress Semiconductor Corp.
pp. 12-13
Panel Summaries

A Methodology for Architectural Design of Multimedia Multiprocessor SoCs (Abstract)

Tiehan Lv , Intel
Jiang Xu , Princeton University
Wayne Wolf , Princeton University
I. Burak Ozer , Verificon
J? Henkel , University of Karlsruhe
pp. 18-26

Energy-Aware Distributed Speech Recognition for Wireless Mobile Devices (Abstract)

Brian Delaney , MIT Lincoln Laboratory
Tajana Simunic , University of California, San Diego
Nikil Jayant , Georgia Institute of Technology
pp. 39-49
Special Features

An Automatic Technique for Optimizing Reed-Solomon Codes to Improve Fault Tolerance in Memories (Abstract)

Gustavo Neuberger , Federal University of Rio Grande do Sul
Fernanda Gusmao de Lima Kastensmidt , Federal University of Rio Grande do Sul
Ricardo Reis , Federal University of Rio Grande do Sul
pp. 50-58

Exploiting ECC Redundancy to Minimize Crosstalk Impact (Abstract)

Daniele Rossi , University of Bologna
Andr? K. Nieuwland , Philips Research Laboratories
Atul Katoch , Philips Research Laboratories
Cecilia Metra , University of Bologna
pp. 59-70

Is it time to reexamine patent policy for standards? (Abstract)

Victor Berman , Cadence Design Systems
pp. 71-73
Book Reviews

An EDA compendium (HTML)

Sachin Sapatnekar , University of Minnesota
pp. 74-75

Conference Reports (Abstract)

pp. 76-78

DATC Newsletter (Abstract)

pp. 79
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