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Issue No. 05 - September/October (2003 vol. 20)
ISSN: 0740-7475
pp: 84-89
Peter C. Maxwell , Agilent Technologies
<p><div><em>Editor's note: </em></div>For years, it has been common to run a test at wafer and then exactly thesame test again at package. This article shows how one company took adetailed look at the wafer/package test mix and adjusted it to reduce costwhile retaining quality.<div><em>—Rob Aitken, Artisan Components</em></div></p>

P. C. Maxwell, "Wafer-Package Test Mix for Optimal Defect Detection and Test Time Savings," in IEEE Design & Test of Computers, vol. 20, no. , pp. 84-89, 2003.
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