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Issue No. 02 - March/April (vol. 20)
ISSN: 0740-7475

Guest editors' introduction: board test (PDF)

M. Lobetti-Bodoni , Siemens Mobile Communications
pp. 5-7

Embedded boundary scan (Abstract)

pp. 20-25
EIC Message

Guest Editors' Introduction: Board Test (HTML)

Monica Lobetti-Bodoni , Siemens Mobile Communications
R.G.(Ben) Bennetts , Bennetts Associates
pp. 5-7

Minimizing Pattern Count for Interconnect Test under a Ground Bounce Constraint (Abstract)

Erik Jan Marinissen , Philips Research Laboratories
Bart Vermeulen , Philips Research Laboratories
Henk Hollmann , Philips Research Laboratories
R.G.(Ben) Bennetts , Bennetts Associates
pp. 8-18

Embedded Boundary Scan (Abstract)

Bradford G. Van Treuren , Lucent Technologies
Jose M. Miranda , Lucent Technologies
pp. 20-25

Electromagnetic Signatures as a Tool for Connectionless Test (Abstract)

Mahnaz Salamati , Orebro University
Dag Stranneby , Orebro University
pp. 26-30

Extending IEEE Std. 1149.4 Analog Boundary Modules to Enhance Mixed-Signal Test (Abstract)

Uros Kac , Jozef Stefan Institute
Franc Novak , Jozef Stefan Institute
Pascal Nouet , LIRMM
pp. 32-39
Special Features

Fast Fault Simulation for Nonlinear Analog Circuits (Abstract)

Nur Engin , Philips Research Laboratories
Hans G. Kerkhoff , MESA+ Research Institute
pp. 40-47

A Design-for-Verification Technique for Functional Pattern Reduction (Abstract)

Chien-Nan Jimmy Liu , National Chiao Tung University
I-Ling Chen , National Chiao Tung University
Jing-Yang Jou , National Chiao Tung University
pp. 48-55

Compilation for FPGA-Based Reconfigurable Hardware (Abstract)

Jo?o M. P. Cardoso , University of Algarve
Hor?cio C. Neto , Technical University of Lisbon
pp. 65-75
Round Table

Test Data Compression (Abstract)

pp. 76-87
Conference Reports

Conference Reports (Abstract)

pp. 88-89
Panel Summaries

ITC 2002 Panels: Part 2 (Abstract)

pp. 90-91

DATC Newsletter (Abstract)

pp. 93

TTTC Newsletter (Abstract)

pp. 94-95
The Last Byte

Testing for what? (Abstract)

Kenneth P. Parker , Agilent Technologies
pp. 96
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