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Issue No. 02 - March/April (vol. 19)
ISSN: 0740-7475

Characterizing substrate coupling in deep-submicron designs (Abstract)

L.M. Silveira , Inst. Superior Tecnico, Tech. Univ. Lisbon, Portugal
pp. 4-15

Online testing approach for very deep-submicron ICs (Abstract)

M. Favalli , Dept. of Eng., Ferrara Univ., Italy
pp. 16-23

CMOS circuits with subvolt supply voltages (Abstract)

M.R. Stan , Virginia Univ., Charlottesville, VA, USA
pp. 34-43

Resizing rules for MOS analog-design reuse (Abstract)

C. Galup-Montoro , Fed. Univ. of Santa Catarina, Brazil
pp. 50-58
EIC Message
Theme Features
Special Feature
The Road Ahead

Shared Red Bricks (Abstract)

pp. 70-71

Standards (Abstract)

pp. 72-73
Panel Summaries

Panel Summaries (Abstract)

pp. 74-76
DATC Newsletter

DATC Newsletter (Abstract)

pp. 77
TTTC Newsletter

TTTC Newsletter (Abstract)

pp. 78-79
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