Issue No. 04 - October-December (2000 vol. 17)
D&T: The motivation behind this roundtable discussion is to educate the readers of IEEE Design & Test Magazine...some industry...area with respect to what are the challenges that we are going to be facing with respect to power delivery and distribution? And what are the power supply noise management strategies that we need to adopt as microprocessors and high-end DSTs ...keep upward stretching. So...here we have microprocessors, DSTs are approaching greater than...in the next couple of generations. And the fundamental challenge that we have in front of us is how do we deliver and distribute about 100 amps at less than one volt for less than fifty dollars? This is the kind of current and voltages that we are looking at two technology generations ahead. Secondly, on-die power density has now become very, very greater than the hot...power density. We have crossed this cross-over point way back in the .6 micron technology base. Unfortunately, the DI by DB noise is only worsening with technology, so it's not scaling at current scale, because the...are improving. The DI by DB is only worsening as technology is scaling. So these are the area challenges ahead of us, and there is some data to show what's happening as technology scales. With technology scaling, we are going from one architecture to another; one micro architecture to another with a new technology. And the DI by DB's only increasing. We are not seeing that scaling down. That means as the architecture evolves, micro architecture from one generation to another, they're only seeing the DI by DB noise worsen. It's not improving. So something is happening in the architecture that's making the DI by DB go up.
"A D&T Roundtable: Power Delivery and Distribution," in IEEE Design & Test of Computers, vol. 17, no. , pp. 98-102, 2000.