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Transistor oxides rupture, metals open or form bridging defects, and integrated circuit parameters can lie outside of normal product distribution. While test and reliability engineers and physicists share these failure modes and have other mutual interests, they often remain isolated from each other. This two-part series from the view of a test engineer explains the major IC reliability failure mechanisms with perspectives on their severity and relation to test. *Part II will appear in the October-December 1999 issue.
Jaume Segura, Charles F. Hawkins, "Test and Reliability: Partners in IC Manufacturing, Part 1", IEEE Design & Test of Computers, vol. 16, no. , pp. 64-71, July-September 1999, doi:10.1109/54.785836
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