The Community for Technology Leaders
Green Image
In recent years, multi-chip modules (MCMs) and other high density packages (HDPs) have become more and more important for high performance electronics. They offer interesting new possibilities to overcome the size, weight, and power constraints for communication, consumer, and automotive markets. With this technology, test and manufacturing aspects have to be considered already during the design process to ensure also an economically optimized product. Therefore, concurrent design of functionality, test, manufacturing, and economic aspects is a must in order to guarantee the "first time right" approach thus improving today's design cycles. In this paper, we present a process-oriented scalable cost modeling tool, the Modular Optimization Environment (MOE), with a graphical user interface (GUI) that companions the design and manufacturing process in order to allow a continuous cost/quality/performance trade-off analysis.
cost modeling, quality, multi-chip module, active substrate

D. Ammann, G. Tröster, A. Thiel, C. Habiger and M. Scheffler, "Modeling and Optimizing the Costs of Electronic Systems," in IEEE Design & Test of Computers, vol. 15, no. , pp. 20-26, 1998.
90 ms
(Ver 3.3 (11022016))