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Scaling down of ICs and the increased packaging densities resulted in increased concern about thermal issues during the design of ICs and their packages. In this paper the advances in the thermal design, measuring and testing methods of ICs are discussed. After presenting the state-of-the-art in the thermal and electro-thermal simulation and measurement methods the idea and methodological questions of the Design for Thermal Testability (DfTT) are discussed. Thermal characterization problems of IC packages are reviewed shortly.
Thermal testing, Thermal design, Electro-thermal simulation, CMOS temperature sensor, Design for Thermal Testability (DfTT), Thermal transient testing, Thermal compact models

V. Székely, B. Courtois and M. Rencz, "Tracing the Thermal Behavior of ICs," in IEEE Design & Test of Computers, vol. 15, no. , pp. 14-21, 1998.
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