Issue No. 03 - July-September (1997 vol. 14)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/54.605998
<p>Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and failure analysis paradigms.</p>
C. L. Henderson, J. M. Soden and R. E. Anderson, "IC Failure Analysis: Magic, Mystery, and Science," in IEEE Design & Test of Computers, vol. 14, no. , pp. 59-69, 1997.