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Issue No. 01 - January-March (1997 vol. 14)
ISSN: 0740-7475
pp: 55-63
ASIC (Application-Specific Integrated Circuit) testability, troubleshooting access and visibility of internal circuitry are the primary targets of test engineering analysis. The widely applied boundary-scan technique does not solve all problems connected with the PBA (Printed Board Assembly) manufacturing process. This paper presents an extension of the boundary-scan technique currently implemented to provide ASIC testability. The concept of Collateral ASIC Test (method and logic) implemented in a boundary-scan device is described as well as the test process standardization implied by this new approach to ASIC design and testing.
ASIC Test, Boundary-scan Test, Reading Status, Test Cost Reduction, Test Standardization

A. Bailey, T. Lada and J. Preston, "Collateral ASIC Test," in IEEE Design & Test of Computers, vol. 14, no. , pp. 55-63, 1997.
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