Issue No. 01 - January-March (1997 vol. 14)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/54.573368
ASIC (Application-Specific Integrated Circuit) testability, troubleshooting access and visibility of internal circuitry are the primary targets of test engineering analysis. The widely applied boundary-scan technique does not solve all problems connected with the PBA (Printed Board Assembly) manufacturing process. This paper presents an extension of the boundary-scan technique currently implemented to provide ASIC testability. The concept of Collateral ASIC Test (method and logic) implemented in a boundary-scan device is described as well as the test process standardization implied by this new approach to ASIC design and testing.
ASIC Test, Boundary-scan Test, Reading Status, Test Cost Reduction, Test Standardization
A. Bailey, T. Lada and J. Preston, "Collateral ASIC Test," in IEEE Design & Test of Computers, vol. 14, no. , pp. 55-63, 1997.