Issue No. 04 - October/December (1993 vol. 10)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/54.245961
<p>The authors describe the multilayer MCM (multichip module) routing problem, and propose an approach for routing high-performance MCMs with the objective of minimizing interconnect delays and crosstalk. They first introduce an approach for rapidly estimating the time-domain response of lossy transmission line trees, and propose a realistic second-order delay model for MCM interconnects. The delay model is used to guide a performance-driven global routing algorithm. Given the 2-D global paths, the next stage is layer assignment. An effective algorithm for constrained layer assignment is developed. Based on the best-known maxcut approximation algorithm (which performs well in practice), a maximal k-color ordering is formulated for minimizing both interlayer and intralayer crosstalk as well as crossings in 3-D MCM substrates. The authors also propose a strategy that exhibits a good tradeoff between circuit performance and design cost, instead of concentrating exclusively on a single objective such as area minimization.</p>
M. Sarrafzadeh, M. Sriram, S. Kang and J. Cho, "High-Performance MCM Routing," in IEEE Design & Test of Computers, vol. 10, no. , pp. 27-37, 1993.