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Issue No. 01 - January/February (1989 vol. 6)
ISSN: 0740-7475
pp: 10-17
<p>The authors describe a proprietary membrane probe card that addresses the needs of testing VLSI devices at the wafer level. The membrane probe allows the testing of devices with a high pin count at operating speed, while allowing a complete package test at the wafer level. The concepts and structure of the probe are examined, and its performance is demonstrated by time-domain and frequency-domain measurements of the typical electrical characteristics of a VLSI digital probe that accesses 272 pads at a pitch of 110 mu m. Applications to a bipolar ECL (emitter-coupled logic) flash A/D (analog-to-digital) converter, a bipolar ECL D/A converter, an application-specific CMOS IC, an NMOS VLSI central processing unit, and area-array solder bumps are presented.</p>

B. Leslie and F. Matta, "Wafer-Level Testing with a Membrane Probe," in IEEE Design & Test of Computers, vol. 6, no. , pp. 10-17, 1989.
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