Issue No. 01 - January (2011 vol. 44)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MC.2011.8
Daniel S. Stevenson , RTI International's Center for Materials and Electronic Technologies
Robert O. Conn , RTI International's Center for Materials and Electronic Technologies
Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs.
3D Silicon interposers, Interconnection architecture, Silicon ICs, Exascale computing
D. S. Stevenson and R. O. Conn, "Bridging the Interconnection Density Gap for Exascale Computation," in Computer, vol. 44, no. , pp. 49-57, 2011.