Issue No. 01 - January (2011 vol. 44)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MC.2011.8
Daniel S. Stevenson , RTI International's Center for Materials and Electronic Technologies
Robert O. Conn , RTI International's Center for Materials and Electronic Technologies
Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs.
3D Silicon interposers, Interconnection architecture, Silicon ICs, Exascale computing
Daniel S. Stevenson, Robert O. Conn, "Bridging the Interconnection Density Gap for Exascale Computation", Computer, vol. 44, no. , pp. 49-57, January 2011, doi:10.1109/MC.2011.8