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<p>Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs settings is included. The case study indicates that the most effective packaging solution for high-performance applications, requiring multichip modules, will likely represent a progression from cofired ceramics (MCM-C) to a thin-film and hybrid cofired ceramic (MCM-D/C) module.</p>

D. P. LaPotin, T. R. Mazzawy and M. L. White, "Early Package Analysis: Considerations and Case Study," in Computer, vol. 26, no. , pp. 30-39, 1993.
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