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ABSTRACT
<p>A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology's IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.</p>
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CITATION

W. Daum, R. A. Fillion and W. E. Burdick, Jr., "Overlay High-Density Interconnect: A Chips-First Multichip Module Technology," in Computer, vol. 26, no. , pp. 23-29, 1993.
doi:10.1109/2.206510
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