The Community for Technology Leaders
Green Image
Issue No. 04 - April (1993 vol. 26)
ISSN: 0018-9162
pp: 13-21
<p>The signal processor packaging design (SPPD) general-purpose digital signal processor (DSP) architecture is discussed. SPPD is a highly modular processor architecture that is based on off-the-shelf components and that supports a multichip module (MCM) design implementation that delivers 400 million floating-point operations per second in a 75-g package. The interconnect-substrate design, MCM package assembly, MCM testing, and tradeoffs in size, weight, and cost of the SPPD packaging are described.</p>

J. K. Hagge and R. K. Scannell, "Development of a Multichip Module DSP," in Computer, vol. 26, no. , pp. 13-21, 1993.
92 ms
(Ver 3.3 (11022016))