Issue No. 04 - April (1993 vol. 26)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/2.206508
<p>The signal processor packaging design (SPPD) general-purpose digital signal processor (DSP) architecture is discussed. SPPD is a highly modular processor architecture that is based on off-the-shelf components and that supports a multichip module (MCM) design implementation that delivers 400 million floating-point operations per second in a 75-g package. The interconnect-substrate design, MCM package assembly, MCM testing, and tradeoffs in size, weight, and cost of the SPPD packaging are described.</p>
J. K. Hagge and R. K. Scannell, "Development of a Multichip Module DSP," in Computer, vol. 26, no. , pp. 13-21, 1993.