Issue No. 12 - December (1992 vol. 25)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/2.179119
<p>Advanced packaging is shifting to greater use of multichip modules (MCMs) for applications, not just those running on mainframes. It is argued that the reasons are threefold: higher performance, smaller size, and lower cost.</p>
J. Balde, "Trends in Advanced Packaging Technology," in Computer, vol. 25, no. , pp. 67-68, 1992.