Issue No. 04 - April (1992 vol. 25)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/2.129048
<p>The production of wafer-scale transducer arrays using laser interconnection techniques and micromatching technology is discussed. The design of a wafer-scale thermal dynamic scene simulator that was implemented using the laser-linking redundancy technique is presented to illustrate typical design requirements. The simulator uses small arrays of thermal pixels and control circuitry in 3 mu m CMOS technology.</p>
M. Parameswaran, M. Syrzycki and G. H. Chapman, "Wafer-Scale Transducer Arrays," in Computer, vol. 25, no. , pp. 50-56, 1992.