The Community for Technology Leaders
RSS Icon
Issue No.04 - April (1992 vol.25)
pp: 50-56
<p>The production of wafer-scale transducer arrays using laser interconnection techniques and micromatching technology is discussed. The design of a wafer-scale thermal dynamic scene simulator that was implemented using the laser-linking redundancy technique is presented to illustrate typical design requirements. The simulator uses small arrays of thermal pixels and control circuitry in 3 mu m CMOS technology.</p>
Glenn H. Chapman, M. Parameswaran, Marek Syrzycki, "Wafer-Scale Transducer Arrays", Computer, vol.25, no. 4, pp. 50-56, April 1992, doi:10.1109/2.129048
6 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool