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CITATION
J.F. McDonald, H.J. Greub, R.H. Steinvorth, B.J. Donlan, A.S. Bergendahl, "Wafer Scale Interconnections for GaAs Packaging-Applications to RISC Architecture", Computer, vol. 20, no. , pp. 21-35, April 1987, doi:10.1109/MC.1987.1663533
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