The Community for Technology Leaders
Green Image
INDEX TERMS
null
CITATION

A. Bergendahl, J. McDonald, R. Steinvorth, H. Greub and B. Donlan, "Wafer Scale Interconnections for GaAs Packaging-Applications to RISC Architecture," in Computer, vol. 20, no. , pp. 21-35, 1987.
doi:10.1109/MC.1987.1663533
82 ms
(Ver 3.3 (11022016))