Call for Papers: IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025)

4 - 6 August 2025 | Madison, Wisconsin, USA
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Submissions Due: 1 April 2025
  • Abstract Submission Deadline: 1 April 2025
  • Full Paper Submission Deadline: 8 April 2025
  • Acceptance Notification: 31 May 2025
  • Camera-Ready Submission: 21 June 2025

Conference date: 4-6 August 2025


IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025)

The IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025) invites submissions for original research, technical papers, and proposals on AI and Smart Systems. IEEE COINS serves as a global forum for academic and industry leaders to discuss the latest advancements in digital transformation and intelligent systems.

IEEE COINS 2025 will be held at the University of Wisconsin–Madison, USA, offering a vibrant and collaborative environment to explore cutting-edge research and technological innovations.

Conference Website

CFP Details


Call for Papers

We invite submissions of high-quality research contributions that address technological advancements, theoretical frameworks, design methodologies, and real-world applications of AI, IoT, and Smart Systems. Topics include but are not limited to:

Topical Areas:

  • Internet of Things (IoT) & AIoT
  • Artificial Intelligence & Machine Learning
  • Blockchain & Distributed Ledger Technologies
  • Cloud & Edge Computing
  • Cybersecurity, Privacy & Trust
  • Low-Power Design & Embedded AI
  • Generative AI & Emerging Intelligent Systems

Industry & Vertical Applications:

  • Smart Cities, Infrastructure & Transportation
  • Digital Healthcare & Well-Being
  • Industry 4.0 & Smart Manufacturing
  • Energy Systems & Smart Grids
  • Sustainable AI & Green Computing

Call for Special Sessions, Workshops & Tutorials

We also welcome proposals for:

  • Workshops – Focused discussions on emerging topics.
  • Tutorials – Expert-led sessions for in-depth learning.
  • Special Sessions – In-depth treatment of trending themes.
  • Panel Discussions – Engaging conversations with industry leaders.

Why Participate?

  • Present your research to an international audience.
  • Network with global experts from academia and industry.
  • Get published in IEEE Xplore.
  • Engage in cutting-edge discussions on AI, IoT, and Smart Systems.

Sponsored By

IEEE COINS 2025 is proudly supported by:

  • IEEE Computer Society
  • IEEE Robotics and Automation Society
  • IEEE Council on Electronic Design Automation (CEDA)
  • IEEE Region 4

Join us in shaping the future of intelligent systems. Submit Your Paper Now: IEEE COINS 2025 Submission.

We welcome you to the University of Wisconsin–Madison for IEEE COINS 2025.