IEEE Transactions on Emerging Topics in Computing

Covering aspects of computer science, computing technology, and computing applications not currently covered by other IEEE Computer Society Transactions

From the October-December 2015 issue

Performance Improvement in SC-MLGNRs Interconnects Using Interlayer Dielectric Insertion

By Atul Kumar Nishad and Rohit Sharma

Featured article thumbnail imageDue to their higher resistance, single layer graphene nanoribbons (GNRs) are not suitable for high-speed on-chip interconnect applications. Hence, we use multilayer GNRs (MLGNRs) that offer multiple conduction channels and lower resistance. However, MLGNRs turn into graphite as the number of layers increase, which reduces the mean-free path of each layer. Insertion of a dielectric between GNR layers prevents its conversion into graphite, thereby improving its mean-free path and scattering rate. In this paper, we are proposing an analytical model for the time-domain analysis of side-contact MLGNRs (SC-MLGNRs) with intermediate dielectric insertion. The proposed model computes scattering rate, mean-free path, and carrier mobility in GNRs where dielectric has been inserted between individual layers. Our analytical results for mobility and scattering rate have been verified with the existing experimental data that exhibit excellent accuracy (maximum of error 4% for mobility and 16% for scattering time). Based on our analysis, we have found that the electron mean-free path in GNRs strongly depends on surrounding dielectric environment. In that, the mean-free path increases with interlayer insertion of high- $k$ dielectrics. Equivalent $RLC$ parameters, delay, energy-delay product, and bandwidth density are calculated for our proposed GNR interconnects using our model. We observe that these performance metrics significantly improve due to the presence of dielectric between GNR layers. When compared with Cu interconnects, insertion of HfO2 between GNR layers results in reduction in both propagation delay and energy-delay product by $2\times $ for interconnect lengths of $1400 ~\mu \text{m}$. In addition, zigzag SC-MLGNR interconnect with $N=10$ and $\varepsilon _{2}=20$ gives nearly 35% higher bandwidth density than that of Cu interconnects for all interconnect lengths. In our analysis, we propose a new performance metric, bandwidth density/energy-delay product to determine the performance limits of our proposed interconnect structure. Finally, we compare the performance of SC-MLGNR interconnect structure with copper and optical interconnects to exhibit its application in local and global interconnects.

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Call for Papers

Technical Tracks

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IEEE Transactions on Emerging Topics in Computing (TETC) seeks original manuscripts for submission under Technical Tracks. In a track the technical contents of a submitted manuscript must be of an emerging nature and fall within the scope and competencies of the Computer Society. Manuscripts not abiding by these specifications will be administratively rejected. The topics of interest for the Technical Tracks are as follows:

  • Enterprise Computing Systems
  • Computational Networks
  • Hardware and Embedded System Security
  • Educational Computing
  • High Performance Computing
  • Next Generation Wireless Computing Systems
  • Computer System Security
  • Emerging Hardware for Computing

Submitted articles must describe original research which is not published or currently under review by other journals or conferences. Extended conference papers should be identified in the submission process and have considerable novel technical content; all submitted manuscripts will be screened using a similarity checker tool. As an author, you are responsible for understanding and adhering to our submission guidelines. You can access them at the IEEE Computer Society web site, Please thoroughly read these before submitting your manuscript.

Please submit your paper to Manuscript Central at and select the "Technical Track" option in the drop-down menu for "Manuscript Type".

Please address all other correspondence regarding this Call For Papers to Fabrizio Lombardi, EIC of IEEE TETC,

Special Issue on Design & Technology of Integrated Systems in Deep Submicron Era

Submission deadline: March 1, 2016. View PDF.

IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Issue/Section on Design & Technology of Integrated Systems in Deep Submicron Era scheduled to appear in the first issue of 2017.

Over the past few years the continuation of Moore’s Law has been achieved through constant advances in manufacturing yield but also the development of dependability design techniques to keep the pace of the growing complexity of the computing systems. Dependable systems can be relied on both against failures caused by aging to random physical effects but also against hostile attacks caused by malicious third parts whose goal is to disrupt operation or leak sensible information. A combined effort to design safe and secure systems is therefore becoming more and more interesting and should be taken into account at the early design stages to optimize application specific solutions. The focus of this special issue includes the design, test and technology of electronic products ranging from integrated circuits modules and printed circuit boards to full systems and microsystems, as well as methodologies and tools used in the design verification and validation of such products. Also special interest is devoted to the design and verification approaches of safe and secure systems and how to leverage common solutions to both of these aspects that are becoming more and more mandatory in the design of today’s computing systems.

Special Issue/Section on Emerging Technologies and Designs for Application-Specific Computing

Submission deadline: March 1, 2016. View PDF.

As devices technology has rapidly evolved, application-specific computing (ASC) has emerged as a new field of research; ASC requires new criteria well beyond traditional practice. ASC is encountering substantial challenges at all levels from new devices, to innovative design principles and applications domains. The focus of this special issue is on emerging technologies in both theory and practice for application-specific computing systems, architectures and processors, inclusive of optimized circuits and modules based on the integration of emerging nano-electronic and post-CMOS devices to extend Moore’s Law. As CMOS technology reaches its scaling and power limitations, novel schemes and computational paradigms are sought for ASC; error tolerant computing, advanced in-memory primitives and emerging application domains such as found in hardware security, image processing and neural computation, are of particular interest.

Special Issue/Section on Next Generation Wireless Computing Systems

Submission deadline: March 1, 2016. View PDF.

IEEE Transactions on Emerging Topics in Computing (TETC) seeks original manuscripts for the special issue on Next Generation Wireless Computing Systems (NGWCS). One aspect to take into account in NGWCS to ensure a better computing performance is the quality of service. Authors are encouraged to submit papers focused on the design, development, analysis or optimization of computing approaches for NGWCS in term of QoS and energy efficiency. The focus of this special issue is on the solutions of QoS and energy efficiency for NGWCS with emphasis on computing.

Joint Special Section on Innovation in Reconfigurable Computing Fabrics: from Devices to Architectures

Submission deadline: April 30, 2016. View PDF.

IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing seek original manuscripts for a Special Section on reconfigurable computing fabrics tentatively scheduled to appear in the June 2017 issues.

Special Issue on Computing Education & Learning Technologies

Submission deadline: June 1, 2016. View PDF.

Technology and education have wandered many separate but rarely intersecting paths throughout the 20th Century. In the 21st Century, the convergence of cost effective computing and networking products, methodologies, and services is finally enabling more researchers and practitioners than ever before to explore innovative ways to use computer technologies to manage and enhance the teaching and learning experience. Recognizing the importance of these trends, this Special Issue/Special Section invites submissions belonging to one or all of the three mainstream learning domains.

Special Issue on Emerging Interconnect Technology for Many-core Architectures

Submission deadline: June 1, 2016. View PDF.

As multicore computing paradigm becomes more complex and heterogeneous, the design and implementation of the underlying communication fabric such as Network-on-Chips (NoCs) to support the massive data transfer within the power budget and performance requirements of the chip is fast becoming an enormous challenge. Further, as future NoCs are expected to connect even larger number of cores, there are several challenges facing designers including excess communication power, reduced performance (throughput, latency), limited scalability and reliability. Emerging technology such as silicon photonics, optical interconnects, wireless and 3D interconnects can provide high interconnect bandwidth, provide minimal access latencies, and high power-efficiency for NoCs. However, there are several technology challenges to realize system wide performance improvement while overcoming the power barrier with multicores. This special issue will highlight the advances in emerging interconnects from the system level to device level where hardware advances are co-designed with new architectures and programming models.

Special Issue on Emerging Trends and Design Paradigms for Memory Systems and Storage

Submission deadline: June 1, 2016. View PDF.

The continuing scaling of silicon-based microelectronic technology, as well as the emergence of new, non-silicon-based technologies, enable increasing system complexity and performance, paving the way to applications which had been unthinkable a few years ago. At the same time, an ever-increasing amount of data needs to be stored and accessed quickly, posing new challenges to memory systems and storage elements. IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Issue/Section on Emerging Trends and Design Paradigms for Memory Systems and Storage covering the entire spectrum of relevant research activities, from manufacturing to test, which is scheduled to appear in the second issue of 2017. All aspects of manufacturing, design, test, reliability, resilience and availability of memory systems and storage are of interest.

Special Issue on Sensor Data Computing as a Service in Internet of Things

Submission deadline: June 1, 2016. View PDF.

The internet-of-things (IoT) has gained significant attention over the past decade. It "allows people and things to be anytime, anyplace, with anything and anyone, ideally using any path/ network and any service." Sensor data computing as a service model (also called sensing as a service) envisions to offer sensor data to interested consumers on demand. It will provide access to sensors or sensor data as a service similar to other utility‐based models such as infrastructure-as-a-service (IaaS), platform-as-a-service (PaaS), and software-as-a-service (SaaS). Sensor data computing as a service model is also expected to be on top of an IoT infrastructure and creates novel business and financial opportunities to increase the sustainability of IoT. The number of things connected to the internet exceeded the number of people on earth in 2008. By 2020, there will be 50 to 100 billion devices connected to the internet, ranging from smartphones, pcs, and ATMs to manufacturing equipment in factories and products in shipping containers. It has been estimated that every individual on earth will have more than six devices connected to the internet by 2020. The sensory data these object produce have significant value to many different parties from supply chain management to healthcare services. Sensor data computing as a service model allows interested parties to buy data from an open market. Sensor data computing as a service model needs to be supported by wide range of sensing and communication technologies. Majority of these sensor data will come from the internet connected smart objects. This special issue will comprise a state of the art research finding related sensor data computing as a service model. This feature will include board range of technologies that involve in deploying and capturing sensor data to processing them in the cloud to deliver them to interested consumers on demand.

Special Issue on Big Data Computing for the Smart Grid

Submission deadline: September 1, 2016. View PDF.

With the increasing deployment of new monitoring devices and advanced measurement infrastructures, such as phasor measurement units and smart meters, smart grid is collecting large amounts of energy-related data at an unprecedented granularity, speed, and complexity. Smart grid has become data-driven, which calls for intelligent big data computing methods and solutions (such as predictive data mining, robust data analytics, artificial intelligence, distributed and high performance computing, efficient data management, database and data warehousing, and cloud computing techniques). With the growing volume, speed and types of big data from the energy industry, data-intensive computing is imperative to guarantee critical functionalities in smart grid, such as real-time wide-area situational awareness, dynamic energy management, demand response, vehicle-to-grid technology, load prediction, and renewable production forecasting. The focus of this special issue is on the improvement of smart grid operations and applications with emphasis on big data computing. We solicit and publish original research papers on the technologies, algorithms, and methodologies that highlight emerging computation technologies for smart grid big data.

Special Issue on Cyber-Physical Social Systems: Integrating Human into Computing

Submission deadline: September 1, 2016. View PDF.

IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Issue on Cyber-Physical-Social Systems: Integrating Human into Computing. The last decade has seen human factors becoming increasingly important in computing systems. Therefore, by integrating human factors as part of a system, a cyber-physical social system (CPSS) encompasses not only cyberspace and physical world, but also human knowledge, mental capacity, and sociocultural elements. Just as the Internet has transformed the way that people interact with information, CPSS will transform the way people interact with every computing systems and create new revolutionary science, technical capabilities for better quality of life. To actualize this vision, CPSS no doubt requires further innovations in creating new device, service and computing architecture. This special issue will comprise state-of-the-art research in enabling cyber-physical social systems with emphasis on computing, including a broad range of enabling technologies in developing and optimizing the architecture, design, and operation of CPSS.

Special Issue on eDemocracy and eGovernment (SIEDEG)

Submission deadline: September 1, 2016. View PDF.

Representatives of the governments, international organizations and universities are called to develop a vision for eDemocracy, and eGovernment. The SIEDEG is a peer-review special issue to be published at IEEE Transactions on Emerging Topics in Computing. It covers technical and non-technical aspects of eSociety, eGovernance, eParticipation, eDemocracy, eGovernment and eHealth. The main objective is to discuss the regions’ transition to an information and knowledge society that will accelerate and enhance regional economic, social, cultural and technological development and exchange. SIEDEG addresses the main issues of public administration and electronic democracy with an academic and practical perspective.

Special Issue on High Dependability Systems

Submission deadline: September 1, 2016. View PDF.

IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Issue/Section on High Dependability Systems scheduled to appear in the third issue of 2017. The continuous scaling of microelectronic technology enables to increase system complexity and performance. This comes together with new dependability (i.e., reliability, availability, safety and security) challenges, as possible in general purpose electronics as well for applications demanding high dependability, such as automotive, space, transportation, etc. All aspects of fault modelling, reliability, availability, safety and security are of interest for this Special Issue/Section. Original manuscripts covering the entire spectrum of relevant research activities are sought.

Special Issue on Emerging Technologies for Disaster Management

Submission deadline: December 1, 2016. View PDF.

We live in a world in which natural and man-made disasters (such as earthquakes, hurricanes, terrorist attacks, and industrial accidents) often occur. These disasters are so sudden in nature, so causing loss of human lives and interruption of essential public services (such as health care, electricity, water, transportation and communication). Disaster management aims to reduce or avoid potential losses from hazards, ensure prompt and appropriate assistance to victims and achieve a rapid and effective recovery. In recent years, new computing/communication technologies have emerged to improve the efficiency of disaster management; for example, crowdsourcing has been applied in the Nepal earthquake to collect the latest information from earthquake-affected areas and create a dynamic map that shows the locations in which aid and relief are needed. Although some preliminary attempts have been made to apply emerging technologies for disaster management, there are many open challenges that need to be addressed to fully exploit the potentials of these promising technologies.

Various technologies must be considered in the entire disaster management process and its many phases, including prevention, preparedness, relief and recovery. Although disasters cannot often be prevented, new technologies must be explored to predict and prepare through robust and resilient infrastructures. After a disaster occurs, advanced technologies are needed to assist in searching and rescuing victims. Since power and communication are usually interrupted, it is important to quickly recover communication using energy-efficient technologies, so that processing of information can take place; furthermore, good planning and scheduling can also help to quickly recover from a disaster.

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