IEEE Transactions on Emerging Topics in Computing

Covering aspects of computer science, computing technology, and computing applications not currently covered by other IEEE Computer Society Transactions

From the July-September 2015 issue

Impact of Realistic Simulation on the Evaluation of Mobile Ad Hoc Routing Protocols

By Jonathan Ledy, Benoit Hilt, Herve Boeglen, Anne-Marie Poussard, Frederic Drouhin, Rodolphe Vauzelle, and Pascal Lorenz

Featured article thumbnail imageToday’s advanced simulators facilitate thorough studies on vehicular ad hoc networks (VANETs). However, the choice of the physical layer and the mobility models in such simulators is a crucial issue that greatly impacts the results. Realistic simulation of routing protocols in VANETs is still an open question. Indeed, only a few works address routing protocols comparison performed under realistic conditions. This paper compares common reactive, proactive, hybrid, and geographic routing protocols using a simulation platform integrating a realistic physical layer and mobility models. It also presents and analyzes several reactive protocol enhancement propositions dedicated to the VANETs context, such as multipath routing, but also protocols tuning, which allows it to adapt faster. They all have lot of attention and are typically proposed to increase the reliability of data transmission. This paper studies the behavior of each protocol in different situations and analyzed their advantages and drawbacks. Results presented in this paper give an important explanation on the contradictory results found in similar works. Finally, our realistic simulations show that reactive protocols are the best suited for VANETs, and more especially the dynamic Mobile Adhoc NETwork on-demand protocol.

download PDF View the PDF of this article      csdl View this issue in the digital library

Editorials and Announcements



Guest Editorials

Reviewers list

Author Index

Call for Papers

Technical Tracks

View PDF.

IEEE Transactions on Emerging Topics in Computing (TETC) seeks original manuscripts for submission under Technical Tracks. In a track the technical contents of a submitted manuscript must be of an emerging nature and fall within the scope and competencies of the Computer Society. Manuscripts not abiding by these specifications will be administratively rejected. The topics of interest for the Technical Tracks are as follows:

  • Enterprise Computing Systems
  • Computational Networks
  • Hardware and Embedded System Security
  • Educational Computing
  • High Performance Computing
  • Next Generation Wireless Computing Systems

Submitted articles must describe original research which is not published or currently under review by other journals or conferences. Extended conference papers should be identified in the submission process and have considerable novel technical content; all submitted manuscripts will be screened using a similarity checker tool. As an author, you are responsible for understanding and adhering to our submission guidelines. You can access them at the IEEE Computer Society web site, Please thoroughly read these before submitting your manuscript.

Please submit your paper to Manuscript Central at and select the "Technical Track" option in the drop-down menu for "Manuscript Type".

Please address all other correspondence regarding this Call For Papers to Fabrizio Lombardi, EIC of IEEE TETC,

Special Issue/Section on Defect and Fault Tolerance in VLSI and Nanotechnology Systems

Submission deadline: December 1, 2015. View PDF.

The continuous scaling of CMOS devices as well as the increased interest in the use of emerging technologies make more and more important the topics related to defect and fault tolerance in VLSI and nanotechnology systems. All aspects of design, manufacturing, test, reliability, and availability that are affected by defects during manufacturing and by faults during system operation, are of interest. The IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Section on Defect and Fault Tolerance in VLSI Systems scheduled to appear in the December issue of 2016.

Special Issue/Section on Emerging Computational Paradigms and Architectures for Multicore Platforms

Submission deadline: December 1, 2015. View PDF.

Multicore and many core embedded architectures are emerging as computational platforms in many application domains ranging for high performance computing to deeply embedded systems. The new generations of parallel systems, both homogeneous and heterogeneous that are developed on top of these architectures represent what is called the emerging computing continuum paradigm. A successful evolution of this paradigm is however imposing various challenges from both an architectural and a programming point of view. The design of embedded multicores/manycores requires innovative hardware specification and modeling strategies, as well as low power simulation, analysis and testing. New synthesis approaches, possibly including reliability and variability compensation, are key issues in the coming technology nodes. Furthermore, thermal aware design is mandatory to manage power density issues. The design of effective interconnection networks is a key enabling technology in a manycore paradigm. New solutions such as photonics and RF NoCs architectures are emerging solutions on this regard. At the same time, these new interconnection systems have to be compliant with innovative 3D VLSI packaging technologies involving vertical interconnections in 3D and stacked ICs. These design solutions enable the integration of more and more IPs, resulting in heterogeneous platform where reconfigurable components, multi-DSP engines and GPUs collaborate to provide the target performance and energy requirements. Along with design and architectural innovations, many challenges have to be faced to enable an effective programming environment to many core systems. These challenges call from innovative solutions at the various levels of the programming toolchain, including compilers, programming models, runtime management and operating systems aspects. Holistic and cross-layer programming approaches have to be targeted considering not only performance, but also energy, dependability and real-time requirements. Finally, on the application side, multicore/manycore embedded systems are pushing developments in various domains such as biomedical, health care, internet of things, smart mobility, and aviation.

This special issue/section asks for emerging computation technology aspects related, but not limited to the mentioned topics. Contributions must be original and highlight emerging computation technologies in design, testing and programming multicore and manycore systems.

Special Issue/Section on New Paradigms in Ad Hoc, Sensor and Mesh Networks, From Theory to Practice

Submission deadline: December 1, 2015. View PDF.

Ad hoc, sensor and mesh networks have attracted significant attention by academia and industry in the past decade. In recent years however new paradigms have emerged due to the large increase in number and processing power of smart phones and other portable devices. Furthermore, new applications and emerging technologies have created new research challenges for ad hoc networks. The emergence of new operational paradigms such as Smart Home and Smart City, Body Area Networks and E-Health, Device-to-Device Communications, Machine-to-Machine Communications, Software Defined Networks, the Internet of Things, RFID, and Small Cells require substantial changes in traditional ad hoc networking. The focus of this special issue is on novel applications, protocols and architectures, non-traditional measurement, modeling, analysis and evaluation, prototype systems, and experiments in ad hoc, sensor and mesh networks.

Special Issue on Design & Technology of Integrated Systems in Deep Submicron Era

Submission deadline: March 1, 2016. View PDF.

IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Issue/Section on Design & Technology of Integrated Systems in Deep Submicron Era scheduled to appear in the first issue of 2017.

Over the past few years the continuation of Moore’s Law has been achieved through constant advances in manufacturing yield but also the development of dependability design techniques to keep the pace of the growing complexity of the computing systems. Dependable systems can be relied on both against failures caused by aging to random physical effects but also against hostile attacks caused by malicious third parts whose goal is to disrupt operation or leak sensible information. A combined effort to design safe and secure systems is therefore becoming more and more interesting and should be taken into account at the early design stages to optimize application specific solutions. The focus of this special issue includes the design, test and technology of electronic products ranging from integrated circuits modules and printed circuit boards to full systems and microsystems, as well as methodologies and tools used in the design verification and validation of such products. Also special interest is devoted to the design and verification approaches of safe and secure systems and how to leverage common solutions to both of these aspects that are becoming more and more mandatory in the design of today’s computing systems.

Special Issue/Section on Emerging Technologies and Designs for Application-Specific Computing

Submission deadline: March 1, 2016. View PDF.

As devices technology has rapidly evolved, application-specific computing (ASC) has emerged as a new field of research; ASC requires new criteria well beyond traditional practice. ASC is encountering substantial challenges at all levels from new devices, to innovative design principles and applications domains. The focus of this special issue is on emerging technologies in both theory and practice for application-specific computing systems, architectures and processors, inclusive of optimized circuits and modules based on the integration of emerging nano-electronic and post-CMOS devices to extend Moore’s Law. As CMOS technology reaches its scaling and power limitations, novel schemes and computational paradigms are sought for ASC; error tolerant computing, advanced in-memory primitives and emerging application domains such as found in hardware security, image processing and neural computation, are of particular interest.

Special Issue/Section on Next Generation Wireless Computing Systems

Submission deadline: March 1, 2016. View PDF.

IEEE Transactions on Emerging Topics in Computing (TETC) seeks original manuscripts for the special issue on Next Generation Wireless Computing Systems (NGWCS). One aspect to take into account in NGWCS to ensure a better computing performance is the quality of service. Authors are encouraged to submit papers focused on the design, development, analysis or optimization of computing approaches for NGWCS in term of QoS and energy efficiency. The focus of this special issue is on the solutions of QoS and energy efficiency for NGWCS with emphasis on computing.

Joint Special Section on Innovation in Reconfigurable Computing Fabrics: from Devices to Architectures

Submission deadline: April 30, 2016. View PDF.

IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing seek original manuscripts for a Special Section on reconfigurable computing fabrics tentatively scheduled to appear in the June 2017 issues.

Special Issue on Computing Education & Learning Technologies

Submission deadline: June 1, 2016. View PDF.

Technology and education have wandered many separate but rarely intersecting paths throughout the 20th Century. In the 21st Century, the convergence of cost effective computing and networking products, methodologies, and services is finally enabling more researchers and practitioners than ever before to explore innovative ways to use computer technologies to manage and enhance the teaching and learning experience. Recognizing the importance of these trends, this Special Issue/Special Section invites submissions belonging to one or all of the three mainstream learning domains.

Special Issue on Emerging Interconnect Technology for Many-core Architectures

Submission deadline: June 1, 2016. View PDF.

As multicore computing paradigm becomes more complex and heterogeneous, the design and implementation of the underlying communication fabric such as Network-on-Chips (NoCs) to support the massive data transfer within the power budget and performance requirements of the chip is fast becoming an enormous challenge. Further, as future NoCs are expected to connect even larger number of cores, there are several challenges facing designers including excess communication power, reduced performance (throughput, latency), limited scalability and reliability. Emerging technology such as silicon photonics, optical interconnects, wireless and 3D interconnects can provide high interconnect bandwidth, provide minimal access latencies, and high power-efficiency for NoCs. However, there are several technology challenges to realize system wide performance improvement while overcoming the power barrier with multicores. This special issue will highlight the advances in emerging interconnects from the system level to device level where hardware advances are co-designed with new architectures and programming models.

Special Issue on Sensor Data Computing as a Service in Internet of Things

Submission deadline: June 1, 2016. View PDF.

The internet-of-things (IoT) has gained significant attention over the past decade. It "allows people and things to be anytime, anyplace, with anything and anyone, ideally using any path/ network and any service." Sensor data computing as a service model (also called sensing as a service) envisions to offer sensor data to interested consumers on demand. It will provide access to sensors or sensor data as a service similar to other utility‐based models such as infrastructure-as-a-service (IaaS), platform-as-a-service (PaaS), and software-as-a-service (SaaS). Sensor data computing as a service model is also expected to be on top of an IoT infrastructure and creates novel business and financial opportunities to increase the sustainability of IoT. The number of things connected to the internet exceeded the number of people on earth in 2008. By 2020, there will be 50 to 100 billion devices connected to the internet, ranging from smartphones, pcs, and ATMs to manufacturing equipment in factories and products in shipping containers. It has been estimated that every individual on earth will have more than six devices connected to the internet by 2020. The sensory data these object produce have significant value to many different parties from supply chain management to healthcare services. Sensor data computing as a service model allows interested parties to buy data from an open market. Sensor data computing as a service model needs to be supported by wide range of sensing and communication technologies. Majority of these sensor data will come from the internet connected smart objects. This special issue will comprise a state of the art research finding related sensor data computing as a service model. This feature will include board range of technologies that involve in deploying and capturing sensor data to processing them in the cloud to deliver them to interested consumers on demand.

Access recently published TETC Articles

RSS Subscribe to the RSS Feed of latest TETC Content Added to the Digital Library.

Mail Sign up for the Transactions Connection Newsletter.