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Issues in Chip-Package Codesign with MCM-D/Flip-Chip Technology
Found in: IC / Package Design Integration, IEEE Symposium on
By P. Franzon, T. Schaffer, S. Lipa, A. Glaser
Issue Date:February 1998
pp. 88
No summary available.
 
A low cost, high performance three-dimensional memory module technology
Found in: Memory Technology, Design and Testin, IEEE International Workshop on
By A. Glaser, M. Nakkar, P. Franzon, G. Rinne, M. Roberson, V. Rogers, C.K. Williams
Issue Date:August 1997
pp. 2
We present a new interconnect/chip-attach technology that provides high volumetric efficiency for systems that are not I/O bound, while also providing low weight, good thermal management and low cost. This attach technology, perpendicular chip attach, is w...
 
Prototype Development of Flip Chip MCMs
Found in: Multi-Chip Module Conference, IEEE
By W. Hansford, J. Peltier, P. Franzon, S. Lipa, J. Schaeffer
Issue Date:February 1997
pp. 133
The MIDAS service at USC/ISI interfaces system designers to domestic Multichip Module (MCM) foundries. Users share tooling and manufacturing costs by merging multiple designs onto a fabrication run and through the use of standard module sizes and packages....
 
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