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Reliability Analysis of Small Delay Defects Due to Via Narrowing in Signal Paths
Found in: IEEE Design & Test of Computers
By H. VILLACORTA,V. Champac,R. Gomez,C. Hawkins,J. Segura
Issue Date:January 2013
pp. 1
Open defects in vias are a dominant failure mechanism in nanometer technologies. Their defect probability has increased with the introduction of the copper process, smaller geometries, and via counts on the order of billions for modern integrated circuits....